Qualcomm Expands Edge AI With New Processors
Qualcomm has introduced the Dragonwing Q-2390 and IQ-2390 processors for intelligent connected devices. The company announced the platforms on September 1, 2026, ahead of IFA 2026.
The new processors target commercial, consumer and industrial applications. Moreover, Qualcomm aims to make edge AI more accessible across devices with tighter cost and power constraints.
Dragonwing Q-2390 Targets Connected Devices
The Dragonwing Q-2390 belongs to Qualcomm’s Q2 Series for commercial and consumer applications. It combines application processing, graphics, vision, AI and real-time processing on one platform.
Furthermore, the processor integrates a quad-core CPU, Adreno 704 GPU, AI acceleration and a RISC-V microcontroller. It supports up to 1.9 GHz CPU speeds and delivers 1.1 TOPS of AI performance.
The platform also supports LPDDR4x memory with up to 8 GB of capacity. Meanwhile, connectivity options include Wi-Fi, Bluetooth, dual Gigabit Ethernet and PCIe.
Qualcomm also offers the Q-2390M variant with integrated LTE Cat 4 connectivity. Therefore, manufacturers can develop products that operate beyond conventional local networks.
The company sees applications across retail, payment systems, access control and smart appliances. In addition, the processor can support home robots, fitness devices and enterprise terminals.
Qualcomm said the platform can process AI workloads locally. As a result, device makers can reduce dependence on the cloud and potentially lower latency.
IQ-2390 Brings AI to Industrial Edge
The Dragonwing IQ-2390 launches as the first processor in Qualcomm’s new IQ2 Series. The series targets compact industrial systems requiring AI, vision and real-time processing.
Unlike the commercial-focused Q-2390, the IQ-2390 targets industrial environments. It supports machine vision, industrial HMIs, gateways, PLCs and building automation systems.
Furthermore, the processor includes dual Gigabit Ethernet with Time-Sensitive Networking. This capability supports time-aware communications for industrial automation.
The IQ-2390 also provides a RISC-V microcontroller for deterministic, real-time processing. Meanwhile, its industrial design supports operating temperatures from -30°C to 115°C.
Qualcomm lists hardware-backed security and ECC memory protection among its industrial features. In addition, the platform carries a 10-year product longevity commitment.
The IQ-2390 supports Android, Yocto Linux, Ubuntu and Zephyr. Therefore, developers can select operating environments suited to different industrial deployments.
Qualcomm Expands Its Edge AI Portfolio
Both processors share a common hardware foundation. Each uses a quad-core Qualcomm Kryo CPU, an Adreno 704 GPU, and a RISC-V MCU.
However, Qualcomm has positioned the two chips for different markets. The Q-2390 focuses on commercial and consumer devices, while the IQ-2390 addresses industrial applications.
The company also expects the platforms to reduce system complexity and development requirements. Consequently, manufacturers can build intelligent devices with fewer separate components.
Several ecosystem companies have already announced support for the new platforms. Fibocom, SECO, Engicam and Eight Development are among the companies cited by Qualcomm.
Qualcomm says customer engagement has already begun through an early access program. Evaluation kits for both processors are expected in early 2027.
Overall, the launch broadens Qualcomm’s Dragonwing strategy across lower-cost edge systems. At the same time, it strengthens the company’s push to place AI processing closer to connected devices.
The move reflects a wider shift toward local intelligence across factories, businesses and homes. As AI workloads spread, compact processors could help manufacturers add intelligence without relying entirely on cloud infrastructure.
