advanced packaging

Samsung Broadcom AI chip partnership
Samsung and Broadcom Sign $200 Billion AI Chip Partnership Through 2030

Samsung Electronics and Broadcom have signed a memorandum of understanding worth more than $200 billion,…

Samsung semiconductor manufacturing facility exterior
Samsung Invests $1.5 Billion In Chip Facility

Samsung plans to invest approximately $1.5 billion in a new semiconductor testing and packaging facility…

Advanced semiconductor chip manufacturing process
TSMC Unveils A13 Chip Process, Skips Costly EUV Tools for Future Growth

Taiwan Semiconductor Manufacturing Company introduced a new lineup of chip technologies during its 2026 North…