Google Explores Samsung Partnership for Next-Generation AI Chips
Google is reportedly in discussions with Samsung Electronics to manufacture part of its next-generation tensor processing unit, codenamed Icefish. The talks reflect the company’s growing need to secure chip production capacity as demand for AI infrastructure continues to rise.
Under the proposed arrangement, TSMC would produce the chip’s most computationally intensive component using its advanced 1.4-nanometer process. Meanwhile, Samsung Electronics would manufacture the memory input/output die with its 2-nanometer technology. The chip, internally known as TPU v10, is being co-developed with MediaTek and could enter mass production around 2028.
Potential Boost for Samsung’s Foundry Ambitions
The potential agreement could provide a significant opportunity for Samsung’s contract chipmaking business. In recent years, the company has faced challenges in securing major orders from leading technology firms. However, Samsung has continued investing heavily in advanced manufacturing technologies and expanding production capacity.
Earlier this year, the company announced plans to invest a record 110 trillion won in chip research and manufacturing expansion during 2026. As a result, securing a share of Google’s TPU production could strengthen confidence in Samsung’s 2-nanometer capabilities.
The discussions are particularly notable because Google recently shifted production of its Pixel Tensor G5 smartphone chip from Samsung to TSMC. That move reportedly surprised Samsung. Nevertheless, participation in Google’s future TPU program could help offset that setback while showcasing its latest manufacturing processes.
Google Diversifies AI Chip Production
The Samsung negotiations form part of Google’s broader strategy to diversify its manufacturing network. As demand for AI accelerators increases, the company has sought additional production partners to reduce supply constraints.
Earlier this month, reports indicated that Google had also engaged Intel to support production of more than three million TPUs by 2028. However, analysts suggested Intel’s contribution would likely focus on advanced packaging rather than chip fabrication.
Google introduced its eighth-generation TPUs, TPU 8t for training and TPU 8i for inference, during its Cloud Next event in April. Additionally, supply chain research indicates that MediaTek continues to play an expanding role in Google’s custom silicon roadmap.
Analysts expect combined TPU shipments to approach five million units by 2028. Consequently, Google is pursuing a multi-foundry strategy to ensure sufficient manufacturing capacity. With TSMC’s most advanced production nodes increasingly oversubscribed, even major cloud providers must diversify portions of their chip supply chains.
