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Silicon Photonics Revolutionize Hardware With Light-Speed AI

Silicon Photonics Revolutionize Hardware With Light-Speed AI

Light-based chip design enhances AI speed and energy efficiency.

Artificial intelligence (AI) continues to evolve rapidly, shaping everything from healthcare to logistics. However, this surge in demand brings a steep cost mainly high energy use and hardware limitations. Today’s AI systems rely heavily on graphical processing units (GPUs). These are energy-intensive and difficult to scale efficiently. As AI models grow larger and more complex, such issues become increasingly problematic. To address them, researchers are exploring faster, more scalable, and sustainable alternatives.

One promising solution lies in light-based computing. Scientists are developing new systems that compute with light rather than electricity. They achieve this using photonic integrated circuits (PICs). This approach dramatically boosts performance while using much less energy. A recent study in the IEEE Journal of Selected Topics in Quantum Electronics highlights how PICs could replace conventional GPUs in AI tasks.

Harnessing Light for Smarter Computing

Dr. Bassem Tossoun and his team at Hewlett Packard Labs introduced a photonic AI platform powered by PICs and III-V compound semiconductors. These materials allow lasers and amplifiers to be embedded directly into the chip. As a result, the system operates faster and more efficiently than traditional silicon-based chips. In addition, optical neural networks (ONNs) on this platform compute at light speed. This greatly reduces energy loss while boosting throughput.

This platform offers another key advantage: better support for wafer-scale integration. That means more components can fit on a single chip critical for future AI systems. According to Dr. Tossoun, their design achieves up to 290 times greater energy efficiency per footprint than other photonic platforms.

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From Fabrication to Future Impact

To build this platform, researchers used a method called heterogeneous integration. It begins with silicon-on-insulator wafers and adds III-V semiconductors using die-to-wafer bonding. The final chip includes lasers, modulators, and photodetectors. These reduce optical loss and improve thermal stability.

As AI moves from electronics to optics, this technology could redefine computing. It may power everything from smart cities to robotics. Not only does it lower energy costs, but it also brings AI closer to real-time, sustainable deployment.

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