Intel’s Turbo Cells to Boost CPU, GPU speeds 2027
Intel has reached a significant milestone in its chip manufacturing journey. In Arizona, the company has officially begun producing its 18A wafers, which will power the upcoming Panther Lake processors. This step is key to completing Intel’s ambitious “five nodes in four years” plan. Meanwhile, Intel also revealed its next-gen 14A process, which introduces an intriguing innovation called “turbo cells” aimed at boosting CPU and GPU performance in 2027.
At its Foundry Direct Connect symposium, Intel showcased these developments as part of a broader effort to reestablish its lead in semiconductor manufacturing. Although Intel previously relied on TSMC for producing tiles in chips like Lunar Lake, the company is shifting that work in-house. This not only reduces costs but also positions Intel to better compete with global foundry leaders.
The 18A node introduces advanced technologies such as RibbonFET and PowerVia. RibbonFET, a gate-all-around transistor design, enhances switching efficiency. PowerVia, Intel’s backside power delivery system, improves power performance by about 4%. Intel stated the 18A process is now in risk production but will soon scale to full volume.
Turbo Cells Signal a New Era
While the 18A technology is foundational, the 14A process represents Intel’s next bold step. Replacing a previously planned 20A node, 14A will integrate PowerDirect, a second-generation power network, and RibbonFET 2, an upgrade to the original RibbonFET structure. These improvements are expected to raise energy efficiency and performance significantly.
But what really stands out is the introduction of turbo cells. According to Intel, these allow for a dynamic mix of high-performance and energy-efficient cells within a single design block. This makes it easier to optimize chips for both speed and power, depending on the application. When paired with RibbonFET 2 and High Numerical Aperture EUV lithography, turbo cells could help Intel achieve superior frequency and data throughput.
Packaging for the Future
Looking ahead, Intel plans to use advanced packaging to combine 14A and 18A dies. Technologies like Foveros Connect 3D stacking and EMIB will allow these chips to work together efficiently. Intel also introduced EMIB-T for high-bandwidth memory, along with new Foveros variants, Foveros-R and Foveros-B, expanding its modular design options.
These announcements collectively reflect Intel’s push to modernize its chipmaking and reclaim technological leadership. If execution matches vision, 2027 could be a landmark year for Intel and its customers.
