Qualcomm has launched the Dragonwing IQ-X Series to elevate industrial computing with next-generation processors designed for PLCs, advanced HMIs, edge controllers, panel PCs, and box PCs. The platform brings powerful single- and multi-thread compute capabilities to factory systems.
It is built to withstand harsh operating conditions and offers extensive peripheral support for streamlined integration across a wide range of industrial machinery. Moreover, the ruggedised package ensures reliable deployment in challenging environments while maintaining low power consumption.
Performance, Durability, and Flexible Deployment
The IQ-X Series is engineered to meet the demanding needs of OEMs and ODMs across industrial settings. It delivers best-in-class compute efficiency, strong lifecycle support, and enhanced security features. At the core of the system lies the Qualcomm Oryon CPU built on 4nm process technology, providing scalable configurations ranging from 8 to 12 high-performance cores.
Additionally, the platform supports up to 45 TOPS of AI performance and an industrial-grade temperature range from –40°C to 105°C. These design choices allow the processors to operate seamlessly in rugged factories while offering long-term scalability.
AI-Driven Capabilities for Future-Ready Manufacturing
The Dragonwing IQ-X Series enables factories to run AI models directly on equipment using popular frameworks such as ONNX and PyTorch. As a result, systems can predict machine failures, monitor equipment health, and detect defects automatically. The platform also operates with standard plug-in modules, allowing companies to upgrade components without redesigning existing hardware.
In addition, it supports Windows 11 IoT, Qt, CODESYS, and EtherCat, making it simple for industries to integrate the new processors into current systems. Overall, Qualcomm aims to accelerate the development of AI-powered automation and smart factory solutions by offering a ready-to-deploy industrial compute platform.








